| 摘要 |
PROBLEM TO BE SOLVED: To provide the thermo compression bonding device and method of electronic components that has excellent insulation performance and a superior response property when temperature falls, and can shorten cycle time. SOLUTION: In the thermo compression bonding device of the electronic components for allowing an electronic component 10 to be subjected to thermo compression bonding, a thermo compression bonding tool 14 for allowing the electronic component 10 to be subjected to thermo compression bonding to work is brought into contact with a ceramic heater 13 for installing, and the ceramic heater 13 is fitted to a block that can be vertically moved via a porous member 12 having excellent venting properties. When the temperature falls after thermo compression bonding, air for cooling is supplied onto the upper surface of a ceramic heater 13 from an air supply source 23 via a through hole 12c that is provided in the porous member 12 for direct cooling, thus securing the excellent insulation performance, and at the same time improving a temperature response property when the temperature falls for shortening the cycle time. |
