发明名称 POWER ELECTRONICS COMPONENT
摘要 The invention relates to a power electronics component that comprises a support element on which conductor tracks (5) are disposed for electrically connecting the electrical power components (7) that are also disposed on the support element and the control components of a circuit. The support element is linked with a thermoconducting housing part of a housing that accommodates the support element in a thermoconductive manner. The support element consists of a porous, ceramics component whose pores are filled with metal and which is covered by a thick-film dielectric on which the conductor tracks (5), in the form of thick-film conductor tracks, and the power components (7) are disposed, and the conductor tracks (5) arm connected to the electrical power components (7) in a electroconductive manner. The support element is disposed to rest against the housing component.
申请公布号 EP1421617(B1) 申请公布日期 2005.11.09
申请号 EP20020798677 申请日期 2002.08.29
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 LUCKE, OLAF;THYZEL, BERND
分类号 H05K7/20;H01L23/15;H01L23/373;H01L25/07;H05K1/05 主分类号 H05K7/20
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