| 摘要 |
Disclosed is a composition for forming a dielectric, which is applied to an embedded capacitor with a high dielectric constant, a capacitor produced using the composition, and a PCB provided with the capacitor. The composition includes 40 to 99 vol % of thermoplastic or thermosetting resin, and 1 to 60 vol % of semiconductive filler. Alternatively, the composition includes 40 to 95 vol % of thermoplastic or thermosetting resin, and 5 to 60 vol % of semiconductive ferroelectric substance. Furthermore, the present invention provides the capacitor, produced using the composition, and the PCB provided with the capacitor. Therefore, the dielectric, which is produced using the composition including the semiconductive filler or semiconductive ferroelectric substance, is advantageous in that the dielectric constant is high and a dielectric loss is low. The dielectric is usefully applied to produce an embedded capacitor with the high dielectric constant and the PCB provided with the embedded capacitor. |
