| 摘要 |
A latent curing agent for epoxy resin can be produced by reacting together: (a) an alicyclic epoxy compound having 2 or more epoxy groups in the molecule; (b) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group; and (c) a compound having in the molecule at least one functional group selected from the group consisting of NH2 group and CONHNH2 group or at least two functional groups selected from the group consisting of OH group, SH group, NH group and COOH group (provided that a compound having an epoxy group or tertiary amino group in the molecule is excluded). When incorporated into an epoxy compound, the latent curing agent gives a curable epoxy resin composition which is rapidly curable at low temperatures, excellent in heat resistance, electrical reliability, etc. and therefore, suitable for use in the electronics field, for instance as an encapsulant for a semiconductor, an anisotropic conductive film, conducting composite, etc.
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