MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a method for producing a multilayer printed circuit board that can be fitted with electronic components. Said method comprises the following steps: an electrically conductive pattern which corresponds to a printed conductor path (12, 16, 20), has a thickness of < 100 micrometers, and is made of a metal-containing paste is applied to a non-conducting carrier substrate (10) by means of a screen printing process; the non-conducting intermediate spaces in the pattern which are determined by the printed conductor path are filled by applying a filling material (14, 18, 22) having the same layer thickness, especially with the aid of a screen printing process; and a masking material (24) that isolates and/or stops the soldering flux is selectively applied to the pattern which is filled with the filling material to form a substantially depression-free planar surface in order to create a solder stop mask, said masking material (24) being applied particularly using a screen printing process. The filling material is selected so as to adhere to both the carrier substrate and the masking material.