Optoelectronic surface mount package

摘要

The package has an optoelectronic chip 22 on a circuit board substrate 24 and an optical element (eg a window, filter or lens) mounted on the optoelectronic chip. An encapsulating layer 28 covers the exposed surfaces of the chip but only partially covers the optical element. A dam may be provided on the substrate for depositing and shaping the encapsulation layer and BGA contacts provide electrical connections to the package.