| 摘要 |
A flip chip integrated package is described as including a chip encapsulated with a mold compound and mounted on a substrate. In one embodiment, the mold compound surrounds the chip, filling in space between the chip and the substrate. The substrate includes a plurality of openings through which the mold compound extrudes, forming molded buttons. In another embodiment, the substrate includes more numerous openings of a smaller diameter, which allow the mold compound to extrude through and create a molded rib. The molded buttons and the molded rib serve as a mount support feature. The substrate includes vents to allow trapped gas to be expelled from the package.
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