发明名称 Blind hole termination of pin to pcb
摘要 Tails ( 20 ) projecting from an electrical component ( 12 ) that lies on a circuit board surface, are terminated to traces on a multi-layer circuit board ( 14 ) in a manner that minimizes the disadvantages of long through hole soldering and of surface mount techniques. A blind hole is drilled and plated in a first layer ( 31 ) that will become the topmost layer of the stack, to form a shallow well ( 70 ). The well is filled with a soldering composition ( 130 ). A tail ( 20 ) is projected downward into the soldering composition, and the soldering composition is heated to solder the tail to the hole plating.
申请公布号 US6963494(B2) 申请公布日期 2005.11.08
申请号 US20030461840 申请日期 2003.06.13
申请人 ITT MANUFACTURING ENTERPRISES, INC. 发明人 MICKIEVICZ SCOTT KEITH;KNAUB JOHN EDWARD
分类号 H05K1/11;H05K3/34;H05K3/46;(IPC1-7):H05K1/11;H05K1/14 主分类号 H05K1/11
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