发明名称 |
Blind hole termination of pin to pcb |
摘要 |
Tails ( 20 ) projecting from an electrical component ( 12 ) that lies on a circuit board surface, are terminated to traces on a multi-layer circuit board ( 14 ) in a manner that minimizes the disadvantages of long through hole soldering and of surface mount techniques. A blind hole is drilled and plated in a first layer ( 31 ) that will become the topmost layer of the stack, to form a shallow well ( 70 ). The well is filled with a soldering composition ( 130 ). A tail ( 20 ) is projected downward into the soldering composition, and the soldering composition is heated to solder the tail to the hole plating.
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申请公布号 |
US6963494(B2) |
申请公布日期 |
2005.11.08 |
申请号 |
US20030461840 |
申请日期 |
2003.06.13 |
申请人 |
ITT MANUFACTURING ENTERPRISES, INC. |
发明人 |
MICKIEVICZ SCOTT KEITH;KNAUB JOHN EDWARD |
分类号 |
H05K1/11;H05K3/34;H05K3/46;(IPC1-7):H05K1/11;H05K1/14 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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