发明名称 |
Integrated circuit system with a latent heat storage module |
摘要 |
The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.
|
申请公布号 |
US6963131(B2) |
申请公布日期 |
2005.11.08 |
申请号 |
US20030692543 |
申请日期 |
2003.10.24 |
申请人 |
TYCO ELECTRONICS AMP GMBH |
发明人 |
FRISCH MICHAEL;EHLER RALF |
分类号 |
H01L23/367;H01L23/373;H01L23/40;H01L23/427;(IPC1-7):H01L23/42;H01L23/043;H05K7/14;F28D17/00 |
主分类号 |
H01L23/367 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|