发明名称 |
Treating copper surfaces for electronic applications |
摘要 |
A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consisting of polypyrrole, polyaniline, polythiophene, and combinations thereof. The conductive polymer promotes adhesion between the resin polymer of the laminate and the smooth copper surfaces.
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申请公布号 |
US6962642(B2) |
申请公布日期 |
2005.11.08 |
申请号 |
US20020255456 |
申请日期 |
2002.09.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KNADLE KEVIN T.;SARGENT ANITA |
分类号 |
B32B15/08;H05K3/38;(IPC1-7):B32B31/12 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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