发明名称 |
Ball grid array attaching means having improved reliability and method of manufacturing same |
摘要 |
An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint. |
申请公布号 |
US6963033(B2) |
申请公布日期 |
2005.11.08 |
申请号 |
US20020032478 |
申请日期 |
2002.01.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM SANG-YOUNG;MOON HO-JEONG;SHIN DONG-KIL;MOK SEUNG-KON |
分类号 |
B23K33/00;B23K1/00;B23K35/02;B23K35/14;H01L21/60;H01L23/12;H01L23/485;H05K1/11;H05K3/34;(IPC1-7):H05K1/16 |
主分类号 |
B23K33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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