| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure for electronic equipment by which heat can radiate fully, even if the volume of an air chamber for storing a heat-generating component is small, and an uneven component and a component made into a high-temperature state are not exposed to the outside. SOLUTION: A part of a casing is formed of a heatsink 2. A component 6 to be heat-radiated is fixed to the internal side of the casing of the heat sink 2. A plate-like member 3 is provided which is arranged to the external side of the casing of the heat sink 2 and formes a vertical ventilation path in-between the heat sink 2. COPYRIGHT: (C)2006,JPO&NCIPI
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