| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal colloid solution containing a metal colloid, which can be applied onto a substrate without previously removing a protective agent contained therein, and can easily remove the protective agent after having been applied onto the substrate, and to provide a production method therefor. SOLUTION: The metal colloid solution comprises fine particles of a metal, and the protective agent which is coupled with the fine particles of the metal to protect them, wherein the protective agent is formed of at least any of organic substances of an alkylamine, a carboxylic acid amide, a fatty acid and a fatty amide; the fine particle of the metal is made of platinum and/or palladium; the protective agent and the fine particle exist in the metal colloid solution at a ratio of the former to the latter of 6:4 to 0.5:9.5 by a mole ratio; and the protective agent is controlled so that the surplus protective agent which is not coupled to the fine particles is not contained. COPYRIGHT: (C)2006,JPO&NCIPI
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