发明名称 |
OXYGEN PUMP |
摘要 |
PROBLEM TO BE SOLVED: To provide an oxygen pump improved in the joining strength between an electrode film and a lead member. SOLUTION: The area of a bonded part by a sintered compact 8 is enlarged by making the area of the anode electrode film 3 smaller than the area of the cathode electrode area 2. As a result, the adhesion strength is improved and therefore the thermal strain generated by heating and energizing is suppressed and the disconnection due to the thermal strain can be prevented. COPYRIGHT: (C)2006,JPO&NCIPI
|
申请公布号 |
JP2005307287(A) |
申请公布日期 |
2005.11.04 |
申请号 |
JP20040126590 |
申请日期 |
2004.04.22 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
UMEDA AKIHIRO;NUMAMOTO HIRONAO;NAGAI TAKESHI |
分类号 |
C25B11/03;C25B1/02;C25B9/00;(IPC1-7):C25B1/02 |
主分类号 |
C25B11/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|