发明名称 OXYGEN PUMP
摘要 PROBLEM TO BE SOLVED: To provide an oxygen pump improved in the joining strength between an electrode film and a lead member. SOLUTION: The area of a bonded part by a sintered compact 8 is enlarged by making the area of the anode electrode film 3 smaller than the area of the cathode electrode area 2. As a result, the adhesion strength is improved and therefore the thermal strain generated by heating and energizing is suppressed and the disconnection due to the thermal strain can be prevented. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005307287(A) 申请公布日期 2005.11.04
申请号 JP20040126590 申请日期 2004.04.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 UMEDA AKIHIRO;NUMAMOTO HIRONAO;NAGAI TAKESHI
分类号 C25B11/03;C25B1/02;C25B9/00;(IPC1-7):C25B1/02 主分类号 C25B11/03
代理机构 代理人
主权项
地址