| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high-frequency power amplifying module of such a structure that precludes abnormal oscillations in a high-frequency power amplifying circuit, while enabling to be miniaturized and thinned. <P>SOLUTION: For constituting the high frequency power amplification module 10, a multilayer board 7 provided with a high-frequency power amplifying circuit block 8 on its upper face is used, and also an input transmission line 2a1 and an output transmission line 2b1 of the high-frequency power amplifying circuit block 8 are formed in the layer 2 of layers in the multilayer board 7, and is pinched between two ground plane layers 1 and 3, which have shielding effect with respect to the input transmission line 2a1 and to the output transmission line 2b1. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
