发明名称 METHOD AND APPARATUS FOR BREAKING OBJECT BY LASER BEAM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method and apparatus which can accurately break or cut an object composed of a material transparent or translucent with respect to a laser beam. <P>SOLUTION: This is a method to help breaking of the object transparent or translucent with respect to a laser beam. In this method, a physical or chemical change is caused inside the object by irradiating it with a laser beam and specifying the breaking position of the object as well as reducing the breaking resistance of the object at that breaking position. The laser beam may be a femtosecond pulsed laser beam. By the irradiation of the laser beam, there is continuously or intermittently caused physical or chemical change along the surface inside the object. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005305462(A) 申请公布日期 2005.11.04
申请号 JP20040122256 申请日期 2004.04.16
申请人 CYBER LASER KK 发明人 SEKIDA HITOSHI
分类号 B26F3/16;B23K26/00;B23K26/40;B28D5/00;C03B33/09;(IPC1-7):B23K26/00 主分类号 B26F3/16
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