| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an optical device having high level of integration and a manufacturing method of the device. <P>SOLUTION: The optical device is configured by disposing a semiconductor chip 30 and an optical element chip 15 in an internal space 14 of a chassis 10 comprising a flat plate base portion 12 and a rib 13 in a rectangular frame shape. A pad electrode 15b of the optical element chip 15 is connected to a wiring line 19 by a first metal wiring line 22a, a pad electrode 30a of the semiconductor chip 30 is connected to the wiring line 19 by a second metal wiring line 22b, and the pad electrodes 15b and 30a are connected by a third metal wiring line 22c. Thus, the optical device having high level of integration is obtained, in which the semiconductor chip 30 and the optical element chip 15 are housed in one package. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
