发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which can improve the accuracy of capacitor characteristics, by preventing the generation of no stray capacitance. <P>SOLUTION: The multilayer printed wiring board is provided with a capacitor that comprises a first electrode formed in a lower layer of vertically continuous overlapping two layers and a second electrode formed, in parallel with the first electrode inside an upper layer of the two layers with a dielectric in-between. In this case, an interlayer connection conductor from the first electrode is connected to a circuit pattern formed in a layer beneath the lower layer, and an interlayer connection conductor from the second electrode is connected to a circuit pattern formed in the upper layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005310895(A) 申请公布日期 2005.11.04
申请号 JP20040122966 申请日期 2004.04.19
申请人 TOPPAN PRINTING CO LTD 发明人 EMORI MASARU
分类号 H05K3/46;H01L23/12;(IPC1-7):H05K3/46 主分类号 H05K3/46
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