| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiator which can make a mounting space on a printed circuit board substantially small and can increase a heat radiation efficiency of an electronic component to be mounted. SOLUTION: A recess 1h for mounting an electronic component 2 therein is formed in part of an outer surface of a heat dissipating object 1 from which heat of the electronic component 2 is to be dissipated. The recess 1h is formed so that part of the electronic component 2 other than a connection terminal 2g is not projected from the outer surface of the object. The heat radiator 1 is formed so that at least a mounting surface of the electronic component 2 is brought into tight contact with the inner wall of the recess 1h. COPYRIGHT: (C)2006,JPO&NCIPI
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