| 摘要 |
PROBLEM TO BE SOLVED: To provide an extrusion moldable non-silicone mold-release resin composition having excellent releasability from a tacky surface and good adhesiveness to a substrate. SOLUTION: The mold-release resin composition contains (A) 100 pts.wt. of a polyolefin resin having an MFR of 0.1-200 g/100 min (in conformity to JIS K7210 at 190°C under 2.16 kgf load), (B) 0.01-10 pts.wt. of a non-silicone urethane compound having a molecular weight of≥300 and <10,000 and containing one or more long-chain alkyl groups in the molecule and (C) 0.1-20 pts.wt. of a releasing polymer other than the olefin resin A and the non-silicone urethane compound B and having a weight-average molecular weight of≥10,000 and≤1,000,000. COPYRIGHT: (C)2006,JPO&NCIPI
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