| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a reliability for connecting an electrode of a semiconductor device with a conductive pattern of a substrate. <P>SOLUTION: A packaging method of the semiconductor device comprises the steps of loading a semiconductor device 2 on one side of the substrate 3 by means of a face down system; detecting the position of an electrode 5 of the semiconductor device 2 on the substrate 3; forming a through-hole 7 for exposing the electrode 5 on the other side of the substrate 3, on the basis of the position; and making electrical continuity, from the electrode 5 to the other side of the substrate 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
