发明名称 COMPONENT BONDER AND BONDING TOOL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide component bonder and bonding tool capable of bonding a long component stably. <P>SOLUTION: In the component bonding tool being employed in a component bonder for bonding a component to a substrate by making load and vibration act on the component, a bonding action portion 10 projecting downward from a horn 8 and having a lower surface 10a butting against the component is formed such that the longitudinal direction of the butting surface 10a is directed in the width direction intersecting the axial direction of the horn 8 perpendicularly and the opposite end parts in the longitudinal direction stretch from the side face 8d of the horn 8 in the width direction, and the portion E having stretched opposite end parts is reinforced by a reinforcing part 9c bonded to the side face 8d in the width direction. Since deformation and uneven vibration of the bonding action portion 10 due to load and vibration are prevented, a long component can be bonded stably. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005311103(A) 申请公布日期 2005.11.04
申请号 JP20040126631 申请日期 2004.04.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKAHASHI SEIJI;HISAKU MASAFUMI;ISHIKAWA TAKATOSHI
分类号 B23K20/10;B23K101/36;H01L21/60;H01L21/607;(IPC1-7):H01L21/60 主分类号 B23K20/10
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