| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method which can lead necessary wiring, without increasing the total number of interconnection layers, and thereby reduce the thickness of the package and contribute to the reduction in manufacturing cost. SOLUTION: In the semiconductor device 10 wherein a chip 30 is mounted inside a wiring board 20, the chip 30 has an interconnection layer 33 which is electrically connected to electrode pads 31, exposed from openings formed in a protection film 32 on the chip and is arranged in the required form. Meanwhile, the wiring board 20 has an interconnection layer 27a, which is electrically connected to the interconnection layer 33 of the chip 30 and is arranged in the required form. The interconnection in the interconnection layer 33 on the chip 30 and the interconnection in the interconnection layer 27a on the wiring board 20 are drawn individually, while organic relation is kept between them. COPYRIGHT: (C)2006,JPO&NCIPI |
