| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition having little curing shrinkage and excellent in crack resistance and a thermosetting resin composition enabling liquefaction without using any solvent or by using a slight amount of organic solvent, free from interlaminar separation, or the like, by a volatile compound remaining in the cured material and excellent in characteristics such as reliability for insulation and heat resistance. SOLUTION: This thermosetting resin composition comprises (A) an epoxy resin, (B) a polyfunctional phenol compound, (C) a curing catalyst, (D) a filler and (E) an oxetane compound, and the oxetane compound (E) is liquid at normal temperature. COPYRIGHT: (C)2006,JPO&NCIPI
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