CONDUCTIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a conductive resin composition enabling conductive connection and fixing of an electronic component to an adherend such as a circuit and making repair and temporal tacking, e.g. detachment of the electronic component easy. SOLUTION: The conductive resin composition comprises a paraffin resin (A) and silver powder (B) as main components and the compounding ratio [B/(A+B)] of the paraffin resin (A) to the silver powder is 11-62 vol% and the silver powder (B) has flakes (B1) having≤50μm diameter and granules (B2) having≤20μm maximum particle diameter and the ratio [B1/(B1+B2)] is 40-90 wt.%. COPYRIGHT: (C)2006,JPO&NCIPI