| 发明名称 |
HEAT-RESISTANT RESIN COMPOSITION, ADHESIVE FILM USING THE SAME, AND POLYIMIDE FILM WITH ADHESIVE |
| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat-resistant resin composition having sufficiently excellent adhesiveness even to a slightly roughened copper foil surface. SOLUTION: The heat-resistant resin composition comprises a heat-resistant resin and a compound represented by formula (1) [wherein, R<SP>1</SP>, R<SP>2</SP>and R<SP>3</SP>are each independently hydrogen atom or a 1-10C alkyl group]. COPYRIGHT: (C)2006,JPO&NCIPI
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| 申请公布号 |
JP2005307052(A) |
申请公布日期 |
2005.11.04 |
| 申请号 |
JP20040127264 |
申请日期 |
2004.04.22 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
MANSEI YOICHIRO;MUKOYAMA YOSHIYUKI;KAMIYA YUKIO;ITO TOSHIHIKO |
| 分类号 |
C08L101/12;C08K5/1565;C08L63/00;C08L79/08;C09J7/00;C09J7/02;C09J169/00;C09J179/08;(IPC1-7):C08L101/12;C08K5/156 |
主分类号 |
C08L101/12 |
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