| 摘要 |
<P>PROBLEM TO BE SOLVED: To control a manufacturing process of a semiconductor device based on a dimension determined by a processed-object dimension measurement process for measuring side dimensions of a pattern formed on a wafer in a non-contact and non-destructive manner at a high speed by using ellipsometry. <P>SOLUTION: About a correction pattern on the wafer of which dimensions are confirmed, the dimension is determined by determining a polarization state parameter to create a database and searching the database based on a polarization parameter of a measurement specimen. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
