| 摘要 |
<P>PROBLEM TO BE SOLVED: To prolong the lifetime, in order to provide a high reliability semiconductor power module at low cost with respect to power cycle and TFT testing. <P>SOLUTION: On the wire bond (the bonding surface 9) of an Al line 8 on a semiconductor chip 1, epoxy coating resin 10, whose coefficient of linear expansion is (10 to 15)×10<SP>-6</SP>/°C, is applied thinly and then is cured. Then, the entirety is sealed with an epoxy filling resin 17, whose coefficient of linear expansion is (17 to 24)×10<SP>-6</SP>/°C equal to solderings 3 and 7. The reinforcement of the wire bond with the coating resin 10 superior in adhesion to the Al line and the chip and the sealing with the filling resin 17 adhesive to the soldering 3 and 7 and the substrate 4 improves the lifetime of the soldering, protects the element portion of the chip, and decrease the curvature of a module. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
