| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimidebenzoxazole film hardly causing warp or the like when a printed wiring board is constituted by laminating a copper layer or the like thereon; and to provide a method for producing the film. SOLUTION: The polyimidebenzoxazole film comprises a polyimidebenzoxazole obtained by reacting aromatic diamines having a benzoxazole structure with anhydrides of aromatic tetracarboxylic acids, and has 12-20 ppm/°C coefficient of linear expansion in face-expansion direction, and 5-12 GPa tensile modulus in the face-expansion direction. The film is obtained by reacting the aromatic diamines with the anhydrides of the aromatic tetracarboxylic acids in an organic solvent to provide a polyamic acid solution, coating the solution on a supporter, drying the coated product to provide a polyamic acid film having 40-55 wt.% remaining solvent rate, and heating the polyamic acid film. COPYRIGHT: (C)2006,JPO&NCIPI |
