| 摘要 |
PROBLEM TO BE SOLVED: To provide a material of a lead-free high temperature solder which can be used in soldering at a high temperature in the range from 250 to 400°C and can achieve high reliability of the joining strength. SOLUTION: The solder material is composed of the alloy having a composition within the region surrounded by the straight lines connecting the following four points A, B, C, and D in a ternary composition diagram of Ag, Cu, and M, the point A (22 wt% Ag, 0 wt% Cu, 78 wt% M), the point B (7.6 wt% Ag, 0 wt% Cu, 92.4 wt% M), the point C (8.6 wt% Ag, 1.0 wt% Cu, 90.4 wt% M), the point D (23 wt% Ag, 1.2 wt% Cu, 75.8 wt% M), and M has a composition comprising, by wt%, 0-9 wt% Sn and the balance being Bi. Further, the solder material does not contain Pb except for unavoidable impurities, and has a melting point of 350-400°C. COPYRIGHT: (C)2006,JPO&NCIPI
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