| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple substrate fixing tool capable of performing offset film deposition without polluting a substrate in the deposit-up type sputtering vapor deposition. SOLUTION: In the deposit-up type sputtering vapor deposition apparatus, a fixing tool comprising a substrate fixing part to prevent a substrate from being dropped even when the substrate is mounted upside down, and a magnet part to fix the substrate to any point of a substrate stage is used. In the deposit-up type sputtering vapor deposition, the substrate is not polluted, and the offset film deposition is also performed. COPYRIGHT: (C)2006,JPO&NCIPI
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