发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a cured resin composition excellent in suitability to stripping with a stripping solution (an aqueous strong alkali solution), and to provide a dry film photoresist. <P>SOLUTION: The photosensitive resin composition contains, as principal components, (A) a monomer component containing a polymerizable compound, (B) a binder component containing a copolymerized polymer and (C) a photopolymerization initiator, wherein the polymerizable compound and/or the copolymerized polymer contains an ester group which comprises a carboxyl group and a hydroxyl group, is stable in a developing solution, and cleaves in a stripping solution. The dry film photoresist has a photosensitive resin composition layer comprising the photosensitive living thing layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005309097(A) 申请公布日期 2005.11.04
申请号 JP20040125974 申请日期 2004.04.21
申请人 FUJI PHOTO FILM CO LTD 发明人 SUGIYAMA TAKEKATSU;WAKATA YUICHI;TAKAHASHI HIDETOMO
分类号 G03F7/027;C08F265/02;G03F7/004;G03F7/033;G03F7/095;H05K3/06 主分类号 G03F7/027
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