发明名称 PHOTOSENSITIVE POLYMER COMPOSITION, METHOD FOR MANUFACTURING RELIEF PATTERN BY USING THE SAME, AND ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive polymer composition which suppresses production of a metal salt and shows a rust prevention effect on a metal layer, a prevention effect against ion migration and improvement in the adhesion with a substrate, to provide a method for manufacturing a relief pattern by using the composition, and to provide electronic components. <P>SOLUTION: The photosensitive polymer composition comprises: (a) a polyimide precursor or polyimide soluble with an alkali aqueous solution; (b) a compound which generates an acid by light; and (c) a cyclic compound. The method for manufacturing a relief pattern includes steps of applying and drying the above photosensitive polymer composition on a supporting substrate, exposing, developing, and heat treating it. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005309215(A) 申请公布日期 2005.11.04
申请号 JP20040128212 申请日期 2004.04.23
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD 发明人 YAMAZAKI NORIYUKI;KANETANI YUICHI
分类号 G03F7/004;G03F7/023;G03F7/037;H01L21/027 主分类号 G03F7/004
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