发明名称 |
PHOTOSENSITIVE POLYMER COMPOSITION, METHOD FOR MANUFACTURING RELIEF PATTERN BY USING THE SAME, AND ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polymer composition which suppresses production of a metal salt and shows a rust prevention effect on a metal layer, a prevention effect against ion migration and improvement in the adhesion with a substrate, to provide a method for manufacturing a relief pattern by using the composition, and to provide electronic components. <P>SOLUTION: The photosensitive polymer composition comprises: (a) a polyimide precursor or polyimide soluble with an alkali aqueous solution; (b) a compound which generates an acid by light; and (c) a cyclic compound. The method for manufacturing a relief pattern includes steps of applying and drying the above photosensitive polymer composition on a supporting substrate, exposing, developing, and heat treating it. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005309215(A) |
申请公布日期 |
2005.11.04 |
申请号 |
JP20040128212 |
申请日期 |
2004.04.23 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
YAMAZAKI NORIYUKI;KANETANI YUICHI |
分类号 |
G03F7/004;G03F7/023;G03F7/037;H01L21/027 |
主分类号 |
G03F7/004 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|