| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer board, where precision in the position between wiring layers formed in a multilayer is increased. SOLUTION: In the manufacturing method of the multilayer board, a conductive wiring layer 14 formed by patterning a conductive film 13 is laminated via an insulating film 12, a circular confirmation hole 14 is provided in the conductive film 13 laminated first, the position of the confirmation section 14 is recognized, and the second wiring layer 18 or thereafter is patterned. By using the confirmation hole 14 having a circular section, the center is recognized, thus performing an accurate and stable recognition. COPYRIGHT: (C)2006,JPO&NCIPI |
