| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a fixture for assembling an electronic part with an adhesive layer preferable for treating a substrate. <P>SOLUTION: The fixture 10 for assembling for treating a reflow for a cream-solder 76 printing to a RAM module 21 and a flip-chip mounting by another CPU module 22 is composed of a base 11, in which a heat-resistant adhesive layer 13 is formed to a top face, and a metallic frame body 12 to which positioning holes 12a and 12a are bored. An accuracy on the place of the RAM module 21 loaded is improved, and the RAM modules 21 are arrayed alternately. A printing positional displacement is reduced by approximately equalizing the thickness of the frame body 12 to that of the RAM module 21 on which cream solder 76 is printed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
