发明名称 METAL MASK AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent a defect such as a crack, an omission or a chip of a solder terminal due to a fault of bleeding or snap-off of cream solder or a fault of slip-off properties of the cream solder from an opening part, and to make the solder terminal free from the defect due to repeated printing, even when a high-precision pattern is printed with a high density and at a high speed on the occasion when the solder terminal for mounting electronic components in a high density is formed of the cream solder by screen printing. SOLUTION: Intermittent electropolishing is applied to an original sheet of a metal mask wherein the opening part for transfer of an electroconductive paste is formed, so as to form the metal mask. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005305725(A) 申请公布日期 2005.11.04
申请号 JP20040123454 申请日期 2004.04.19
申请人 PROCESS LAB MICRON:KK 发明人 SUZUKI ATSUSHI;CHIBA HIDEKI
分类号 B41C1/14;B41N1/24;H05K3/34;(IPC1-7):B41N1/24 主分类号 B41C1/14
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