| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for grinding a wafer for uniformly grinding the straight part of the wafer without generating a movement trace. <P>SOLUTION: A grinding member 11 having a circular plane grinding face A is rotated, and a linear part W1 is brought into contact with the grinding face A after being deviated from an axial center C, and a wafer W is moved back and forth in the direction of the linear part W1 to the both sides of the radial R of the grinding face A vertical to the linear part W1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
