发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device, having an interlayer insulating film which is superior in the embedding properties between device elements formed on a semiconductor substrate. SOLUTION: The semiconductor device has stacked-layer gate electrodes (1 to 7) formed on a semiconductor substrate (1), and an interlayer insulating film (10A) formed on the semiconductor substrate (1) so as to embed itself between the stacked-layer gate electrodes (1 to 7), wherein the impurity concentration within the interlayer insulating film (10A) is nonuniform in the thickness direction. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005311318(A) 申请公布日期 2005.11.04
申请号 JP20050073411 申请日期 2005.03.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKAMORI MASUNORI
分类号 C23C16/34;H01L21/31;H01L21/316;H01L21/768;H01L23/522;(IPC1-7):H01L21/316 主分类号 C23C16/34
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