发明名称 FORMATION METHOD OF ALUMINUM WIRING
摘要 PROBLEM TO BE SOLVED: To provide the formation method of aluminum wiring which realizes formation of aluminum wirings, by filling in opening parts of different sizes, including a fine groove and hole at a normal pressure, and enables the fine groove and hole for wiring to be charged with aluminum by plating. SOLUTION: In the formation method of aluminum wiring, an insulating layer with an opening is provided to a wiring substrate surface; a seed metal layer is deposited at the bottom and a sidewall surface inside the opening and in the surface of the insulating layer; the opening is charged with aluminum or aluminum alloy through plating; and a metal layer, containing aluminum or aluminum alloy other than the inside of the opening, is removed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005311087(A) 申请公布日期 2005.11.04
申请号 JP20040126205 申请日期 2004.04.22
申请人 HITACHI LTD 发明人 HASHIBA TOSHIO;AKABOSHI HARUO
分类号 C25D7/12;H01L21/28;H01L21/288;H01L21/3205;H01L23/52;(IPC1-7):H01L21/320 主分类号 C25D7/12
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