| 摘要 |
PROBLEM TO BE SOLVED: To provide a UV-curable resin composition good in thermal stability and used for temporarily fixing small module parts or the like because of its adhesiveness at 10-40°C, for treating at a high temperature in a reflow furnace which is a fusion step of solder, removing the small module parts or the like after cooling to 10-40°C, and for temporarily fixing again, and a compound material for temporarily fixing the parts using the composition. SOLUTION: This UV-curable resin composition comprises 30-70 pts.wt, of a urethane acrylate-based photopolymerizable oligomer (A) having two or more acryloyl groups in a molecule, 70-30 pts.wt. of a urethane acrylate-based photopolymerizable oligomer (B) having one acryloyl group in a molecule, 5-30 pts.wt. of a urethane acrylate-based oligomer (C) having no acrylate in a molecule, and 0.5-10 pts.wt. of photopolymerization initiator (D). COPYRIGHT: (C)2006,JPO&NCIPI
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