TRANSPORT POD PROTECTED BY THERMOPHORESIS EFFECT

摘要

PROBLEM TO BE SOLVED: To improve the removal of contaminated particles by avoiding the adhesion of the contaminated particles onto the effective surface of a mask or semiconductor wafer while the mask or semiconductor wafer is placed in a transport pod. SOLUTION: The transport pod 1 for the mask or semiconductor wafer 2 is provided with a leakage preventive peripheral wall 3 enclosing an internal space 4 that receives the mask or wafer 2. A thermally conductive support means 11 retains the mask or wafer 2. A cold plate 7 thermally connected to a cooling source 8 generates a temperature gradient toward the main surface 6 of the mask or wafer 2 that should be protected from the contamination caused by the particles. The plate 7 is retained by a connection means 7b including a heat insulation means 7c. An on-board energy source 9 supplies an electric power to the source 8, thereby largely reducing the deposition of the contaminated particles onto the surface 6 of the mask or wafer 2. COPYRIGHT: (C)2006,JPO&NCIPI