| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated substrate, with which a gap is filled surely with resin, without previously filling the gap between an electronic component and the substrate with an intermediate material. <P>SOLUTION: Thermosetting resin for a pre-preg is a plate member in a first temperature range, has heat flow kinesis in a second temperature range, and is hardened in a third temperature range. A evacuation process 119, making an air gap and a gap into vacuum, a softening process 120 for heating the pre-preg to the second temperature range and softening it, a forced inflow process 122 for compressing the pre-preg, before the pre-preg becomes the third temperature range and making the resin flow forcedly into the gap and a hardening process 123 for heating the pre-preg to the third temperature range are provided. The temperature of the pre-preg releases the vacuum between the softening temperature of the pre-preg and the upper limit temperature of the second temperature range. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
