| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic component packages, by which electronic component packages can be manufactured efficiently. SOLUTION: The method of manufacturing the electronic component package 20 comprises processes of forming interconnections 15 and 16 on a substrate 13, mounting an electronic component 10 on the interconnections 15 and 16, sealing the electronic component 10 by a resin 23, and removing the substrate 13. The process of removing the substrate 13 is performed by etching the substrate 13, using an etchant which has a larger etching rate, with respect to the interconnections 15 and 16 than with respect to the substrate 13. COPYRIGHT: (C)2006,JPO&NCIPI
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