| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing methods for a low-cost and connectivity-reliable semiconductor chip and a semiconductor device having the semiconductor chip, and to provide a manufacturing method for the semiconductor device, as well as an electronic device having the semiconductor device. <P>SOLUTION: A semiconductor device 1 has a semiconductor chip 2 having a bump 10, and a wiring substrate 4 equipped with a land 3, wherein the bump 10 and the land 3 are connected through conductive particles 5 distributed in an insulating material and the bump 10 has a first conductive layer 11, a second conductive layer 12 in contact with the first conductive layer 11, and a third conductive layer 13 in contact with the second conductive layer 12, and further, electrical connections are carried out, in a state where the conductive particles 5 bite into the third conductive layer 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
