| 摘要 |
PROBLEM TO BE SOLVED: To obtain a film-shaped epoxy resin composition and a film-shaped adhesive that have high flowability at melt and can secure sufficient adhesion at a pressure lower than a conventional pressure. SOLUTION: This film-shaped epoxy resin composition comprises not less than 50 wt.% of a liquid epoxy resin with a dynamic viscosity at 25°C of not more than 100 Pa-s, a solid curing agent with a softening point of not more than 125°C and having at least two hydroxy groups in the molecule, and 5-45 pts.wt. of a seat forming agent having a molecular weight of 10,000-1,000,000, based on the total 100 pts.wt. of the epoxy resin and the curing agent, wherein the dynamic viscosity of the resin composition when heating/melting is 100-5,000 Pa-s. COPYRIGHT: (C)2006,JPO&NCIPI
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