| 摘要 |
PROBLEM TO BE SOLVED: To provide the soldered joint checking method of an electronic device, capable of directly confirming whether mounting is normal or defective, when electronic devices, such as chip devices are mounted on a circuit substrate or the like. SOLUTION: Soldering is performed, by mounting an electrode terminal 12 of the chip device 10 on the circuit substrate 15, making a land electrode 16 of the circuit substrate 15 correspond to a face positioned downward, in order to mount the chip device 10 on the circuit substrate 15. After the soldering has been performed, if the electronic terminal 12a and a soldered section 13a of the land electrode 16a are observed at the deep section of a through hole 14a, when the chip device 10 is visually observed from above, it is confirmed as being a normal mounting; and if the electronic terminal 12b and the soldered section 13b of the land electrode 16b are observed at a shallow part closer to an upper opening of the throughhole 14b, it is confirmed as being a defective mounting. COPYRIGHT: (C)2006,JPO&NCIPI
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