| 摘要 |
PROBLEM TO BE SOLVED: To provide a susceptor that does not require cutting of a semiconductor wafer surface, has a long life, can be stably used, and can heat a wafer surface uniformly. SOLUTION: In the susceptor including at least a surface comprises SiC, and a recess for mounting a wafer, an R portion is provided at a lower part of an outer circumferential portion of the recess, a crystal growth surface portion of SiC exists in a ring shape inside the R portion and at least in a range of 0.05 mm to 0.3 mm from a vertical portion of the outer circumference of the recess, and a portion of the recess that is contacted to the wafer has surface roughness Ra of 0.5μm to 3μm. COPYRIGHT: (C)2006,JPO&NCIPI
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