发明名称 CONTROL OF AMBIENT ENVIRONMENT USING PROXIMITY HEAD DURING WAFER DRYING
摘要 PROBLEM TO BE SOLVED: To provide an apparatus which efficiently supplies and removes fluids to and from wafer surfaces while reducing contamination and decreasing wafer cleaning cost. SOLUTION: While a fluid meniscus treats a top surface 108a, a wafer 108 is rotated, or may be held still, and a proximity head 106 is moved. The proximity head 106 includes source inlets 1302 and 1306 and a source outlet 1304. Isopropyl alcohol vapor 1310 in nitrogen gas is supplied to the wafer surface through the source inlet 1302, and a vacuum 1312 acts on the wafer surface through the source outlet 1304, and a treatment fluid 1314 is supplied to the wafer surface through the source inlet 1306. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005311354(A) 申请公布日期 2005.11.04
申请号 JP20050100376 申请日期 2005.03.31
申请人 LAM RES CORP 发明人 KOROLIK MIKHAIL;DE LARIOS JOHN M;RAVKIN MIKE;FARBER JEFFREY
分类号 H01L21/304;B08B3/04;H01L21/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
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