| 摘要 |
PROBLEM TO BE SOLVED: To provide a tantalum electrolytic capacitor which can hold an air tightness of a tantalum electrolytic capacitor element even when the tantalum electrolytic capacitor is exposed to a high temperature when the tantalum electrolytic capacitor is soldered and which excels in mass production nature, and which can be miniaturized. SOLUTION: A ceramic vessel 6 is provided with: a ceramic substrate 3 in which a recess 3-B is formed on an upper surface and a first metallized layer 3a and a second metallized layer 3b are formed inside the recess 3-B and a first conductor layer 3c and a second conductor layer 3d are formed on a lower surface; a first connecting conductor 3e which is formed extending over the first metallized layer 3a and the first conductor layer 3c; and a second connecting conductor 3f which is formed extending over the second metallized layer 3b and the second conductor layer 3d. The first metallized layer 3a is formed extending over an upper surface of a step 3-C formed between a side face of the recess 3-B and a bottom face thereof, and the side face of the recess 3-B. COPYRIGHT: (C)2006,JPO&NCIPI
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