| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor device and a semiconductor device package which can highly efficiently arrange a plurality of functional chips, at the arranged positions on a package board/ in a packaging method which utilizes self alignment in liquid. SOLUTION: A method for mounting semiconductor device comprises the steps of preparing a packaging board 102 which is formed on a principal plane and has a plurality of recess portions 104, corresponding to a plurality of functional chips 103, and a flat plate 101 which has a plurality of confinement ranges 101a, composed of respective opening portions and in each of which a recess portion 104 is exposed and a functional chip 103 is confined; of mounting the respective functional chips 103 in the confinement region 101a on the packaging board 102; of soaking the packaging board 102, having the functional chip 103, into liquid together with the flat plate 101; and then of giving vibration to the flat plate 101 with it being soaked in liquid, so that each functional chip 103 can be fitted quickly in the recess portion 104, in a packaging board 102. COPYRIGHT: (C)2006,JPO&NCIPI |
